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1

Statistical Distribution of Through-Silicon via Cu Pumping

De Messemaeker, Joke, Roussel, Philippe J., Pedreira, Olalla Varela, Van der Donck, Tom, Van Huylenbroeck, Stefaan, Beyne, Eric, De Wolf, Ingrid, Stucchi, Michele, Croes, Kristof

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.67 MB

english, 2017

2

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

B. Dimcic, R. Labie, J. De Messemaeker, K. Vanstreels, K. Croes, B. Verlinden, I. De Wolf

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 449 KB

english, 2012

3

Sn whisker evaluations in 3D microbumped structures

Vakanas, G.P., Vandecasteele, B., Schaubroek, D., De Messemaeker, J., Willems, G., Ashworth, M.A., Wilcox, G.D., De Wolf, I.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 3.31 MB

english, 2014

4

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability concerns in copper TSV's: Methods and results

Croes, Kristof, Cherman, Vladimir O., Li, Yunlong, Zhao, Larry, Barbarin, Yohan, De Messemaeker, Joke, Civale, Yann, Velenis, Dimitrios, Stucchi, Michele, Kauerauf, Thomas, Redolfi, Augusto, Dimcic, B

Year:

2012

Language:

english

File:

PDF, 332 KB

english, 2012

5

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Impact of oxide liner properties on TSV Cu pumping and TSV stress

De Messemaeker, J., Pedreira, O. Varela, Moussa, A., Nabiollahi, N., Vanstreels, K., Van Huylenbroeck, S., Philipsen, H., Verdonck, P., Vandevelde, B., De Wolf, I., Beyne, E., Croes, K.

Year:

2015

Language:

english

File:

PDF, 1.20 MB

english, 2015

6

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling

Nabiollahi, Nabi, Moelans, Nele, Gonzalez, Mario, De Messemaeker, Joke, Wilson, Christopher J., Croes, Kristof, Beyne, Eric, De Wolf, Ingrid

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.72 MB

english, 2015

7

Reliability challenges related to TSV integration and 3D stacking

Croes, Kristof, De Messemaeker, Joke, Li, Yunlong, Guo, Wei, Pedreira, Olalla, Cherman, Vladimir, Stucchi, Michele, De Wolf, Ingrid, Beyne, Eric

Journal:

IEEE Design and Test

Year:

2015

Language:

english

File:

PDF, 949 KB

english, 2015

8

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Ključar, Luka, González, Mario, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Murdoch, Gayle, Nolmans, Philip, De Vos, Joeri, Bömmels, Jürgen, Beyne, Eric, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.81 MB

english, 2017

9

Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Panchenko, Iuliana, Wolter, Klaus-Juergen, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Beyne, Eric, Wolf, M. Juergen

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 10.04 MB

english, 2019

10

Texture of IF steel after equal channel angular pressing (ECAP)

J. De Messemaeker, B. Verlinden, J. Van Humbeeck

Journal:

Acta Materialia

Year:

2005

Language:

english

File:

PDF, 1.35 MB

english, 2005

11

On the impossibility of multi-pass equal-channel angular drawing

Jon Alkorta, Marleen Rombouts, Joke De Messemaeker, Ludo Froyen, Javier Gil Sevillano

Journal:

Scripta Materialia

Year:

2002

Language:

english

File:

PDF, 345 KB

english, 2002

12

On the strength of boundaries in submicron IF steel

J. De Messemaeker, B. Verlinden, J. Van Humbeeck

Journal:

Materials Letters

Year:

2004

Language:

english

File:

PDF, 199 KB

english, 2004

13

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Phase formation in Cu/Ni/Sn thin film systems

Dimcic, Biljana, De Messemaeker, Joke, Zhang, Wenqi, Kristof, Croes, Vanstreels, Kris, Verlinden, Bert, DeWolf, Ingrid

Year:

2012

Language:

english

File:

PDF, 2.02 MB

english, 2012

14

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Panchenko, Iuliana, Croes, Kristof, De Wolf, I., De Messemaeker, J., Beyne, Eric, Wolter, Klaus-Juergen

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 5.96 MB

english, 2014

15

[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - Impact of through silicon vias on front-end-of-line performance after thermal cycling and thermal storage

Cherman, V.O., De Messemaeker, J., Croes, K., Dimcic, B., Van der Plas, G., De Wolf, I., Beyer, G., Swinnen, B., Beyne, E.

Year:

2012

Language:

english

File:

PDF, 533 KB

english, 2012

16

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling

Nabiollahi, Nabi, Moelans, Nele, Gonzalez, Mario, De Messemaeker, Joke, Wilson, Christopher J., Croes, Kristof, Beyne, Eric, De Wolf, Ingrid

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

17

[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's

Wilson, C. J., De Wolf, I., Vandevelde, B., De Messemaeker, J., Ablett, J. M., Redolfi, A., Simons, V., Beyne, E., Croes, K.

Year:

2012

Language:

english

File:

PDF, 520 KB

english, 2012

18

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Minimizing interposer warpage by process control and design optimization

Detalle, Mikael, Vandevelde, B., Nolmans, P., De Messemaeker, J., Gonzalez, M., Miller, A., Manna, A. La, Beyer, G., Beyne, E.

Year:

2014

Language:

english

File:

PDF, 3.35 MB

english, 2014

19

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

De Messemaeker, Joke, Pedreira, Olalla Varela, Vandevelde, Bart, Philipsen, Harold, De Wolf, Ingrid, Beyne, Eric, Croes, Kristof

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

20

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Thermal mismatch induced reliability issues for Cu filled through-silicon vias

De Messemaeker, Joke, Croes, Kristof, Vandevelde, Bart, Velenis, Dimitrios, Redolfi, Augusto, Jourdain, Anne, Beyer, Gerald, Swinnen, Bart, Beyne, Eric, DeWolf, Ingrid

Year:

2012

Language:

english

File:

PDF, 988 KB

english, 2012

21

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Correlation between Cu microstructure and TSV Cu pumping

De Messemaeker, Joke, Pedreira, Olalla Varela, Philipsen, Harold, Beyne, Eric, De Wolf, Ingrid, Van der Donck, Tom, Croes, Kristof

Year:

2014

Language:

english

File:

PDF, 2.92 MB

english, 2014

22

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation of Cu pumping during TSV fabrication

Nabiollahi, N., Wilson, C. J., De Messemaeker, J., Gonzalez, M., Croes, K., Beyne, E., De Wolf, I.

Year:

2013

Language:

english

File:

PDF, 631 KB

english, 2013

23

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Armini, S., De Messemaeker, J., Whelan, C. M., Moinpour, M., Maex, K.

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 879 KB

english, 2008

24

Structural Evolution of IF Steel during Annealing after ECAP

De Messemaeker, Joke, Verlinden, Bert, Van Humbeeck, Jan

Journal:

Materials Science Forum

Year:

2004

Language:

english

File:

PDF, 1021 KB

english, 2004

25

Composite polymer core – ceria shell abrasive particles during silicon oxide CMP

Armini, Silvia, De Messemaeker, Joke, Burtovyy, Ruslan, Luzinov, Igor, Whelan, Caroline M., Moinpour, Mansour, Maex, Karen

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 916 KB

english, 2007

26

Interaction Forces Between a Glass Surface and Ceria-Modified PMMA-Based Abrasives for CMP Measured by Colloidal Probe AFM

Armini, Silvia, Burtovyy, Ruslan, Moinpour, Mansour, Luzinov, Igor, De Messemaeker, Joke, Whelan, Caroline M., Maex, Karen

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 569 KB

english, 2008

27

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill — Process and reliability

Wang, Teng, De Messemaeker, Joke, Cherman, Vladimir, Kay, Alvin Chow Chee, Cadacio, Francisco, Matterne, Mireille, Simons, Veerle, Van De Peer, Myriam, Lesniewska, Alicja, Pedreira, Olalla Varela, Ger

Year:

2015

Language:

english

File:

PDF, 3.71 MB

english, 2015

28

[IEEE 2017 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2017.4.2-2017.4.6)] 2017 IEEE International Reliability Physics Symposium (IRPS) - Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects

Pedreira, O. Varela, Croes, K., Lesniewska, A., Wu, C., van der Veen, M. H., de Messemaeker, J., Vandersmissen, K., Jourdan, N., Wen, L.G., Adelmann, C., Briggs, B., Gonzalez, V. Vega, Bommels, J., To

Year:

2017

Language:

english

File:

PDF, 735 KB

english, 2017

29

[IEEE 2017 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2017.12.2-2017.12.6)] 2017 IEEE International Electron Devices Meeting (IEDM) - Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

Beyne, Eric, Kim, Soon-Wook, Peng, Lan, Heylen, Nancy, De Messemaeker, Joke, Okudur, Oguzhan Orkut, Phommahaxay, Alain, Kim, Tae-Gon, Stucchi, Michele, Velenis, Dimitrios, Miller, Andy, Beyer, Gerald

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

30

Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices

Oba, Yoshiyuki, De Messemaeker, Joke, Tyrovouzi, Anna Maria, Miyamori, Yuichi, De Vos, Joeri, Wang, Teng, Beyer, Gerald, Beyne, Eric, De Wolf, Ingrid, Croes, Kristof

Journal:

Japanese Journal of Applied Physics

Year:

2015

Language:

english

File:

PDF, 798 KB

english, 2015

31

Growth of Millimeter-Sized Graphene Single Crystals on Al 2 O 3 (0001)/Pt(111) Template Wafers Using Chemical Vapor Deposition

Verguts, Ken, Defossez, Yves, Leonhardt, Alessandra, De Messemaeker, Joke, Schouteden, Koen, Van Haesendonck, Chris, Huyghebaert, Cedric, De Gendt, Stefan, Brems, Steven

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 967 KB

english, 2018

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